bat54, a, c, s ? june 1999 - ed: 3a small signal schottky diode very small conduction losses negligible switching losses low forward voltage drop surface mount device features and benefits schottky barrier diodes encapsulated in a sot-23 small smd packages. double diodes with different pining are available. description sot-23 k k a a nc symbol parameter value unit v rrm repetitive peak reverse voltage 30 v i f continuous forward current 0.3 a i fsm surge non repetitive forward current tp=10ms sinusoidal 1 a p tot power dissipation (note 1) t amb = 25c 250 mw t stg maximum storage temperature range - 65 to +150 c tj maximum operating junction temperature * 150 c t l maximum temperature for soldering during 10s 260 c note 1: for double diodes, ptot is the total dissipation of both diodes. absolute ratings (limiting values) bat54 a2 a2 a1 a1 k k bat54c a2 a2 a1 k2 a1 k2 k1 k1 bat54s * : dptot dtj < 1 rth ( j - a ) thermal runaway condition for a diode on its own heatsink k2 k2 k1 k1 a a bat54a 1/5
symbol parameters tests conditions min. typ. max. unit v f * forward voltage drop tj = 25 ci f = 0.1 ma 240 mv i f = 1 ma 320 i f = 10 ma 400 i f = 30 ma 500 i f = 100 ma 900 i r ** reverse leakage current tj = 25 cv r = 30 v 1 m a tj = 100 c 100 pulse test : * tp = 380 m s, d < 2% ** tp = 5 ms, d < 2% static electrical characteristics (per diode) symbol parameters tests conditions min. typ. max. unit c junction capacitance tj = 25 cv r = 1 v f = 1 mhz 10 pf t rr reverse recovery time i f = 10 ma i r = 10 ma tj = 25c i rr = 1 ma r l = 100 w 5ns dynamic characteristics (tj = 25 c) 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 pf(av)(w) d = 0.2 d = 0.5 d = 1 d = 0.05 d = 0.1 if(av) (a) t d =tp/t tp fig.1 : average forward power dissipation versus average forward current. 0 25 50 75 100 125 150 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 if(av)(a) t d =tp/t tp tamb(c) fig.2 : average forward current versus ambient temperature ( d = 1). symbol parameter value unit r th (j-a) junction to ambient (*) 500 c/w (*) mounted on epoxy board with recommended pad layout. thermal resistance bat54, a, c, s 2/5
1e-3 1e-2 1e-1 1e+0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 im(a) ta=25c ta=50c ta=100c i m t d =0.5 t(s) fig.3 : non repetitive surge peak forward current versus overload duration (maximum values). 0 5 10 15 20 25 30 1e-2 1e-1 1e+0 1e+1 1e+2 vr(v) ir(a) tj=50c tj=25c tj=100c fig.5 : reverse leakage current versus reverse voltage applied (typical values). 1e-3 1e-2 1e-1 1e+0 1e+1 1e+2 0.01 0.10 1.00 tp(s) zth(j-a)/rth(j-a) t d =tp/t tp single pulse d = 0.1 d = 0.2 d = 0.5 fig.4 : relative variation of thermal impedance junction to ambient versus pulse duration (alumine substrate 10mm x 8mm x 0.5mm). 0 25 50 75 100 125 150 1e-2 1e-1 1e+0 1e+1 1e+2 1e+3 1e+4 ir(a) vr=30v tj(c) fig.6 : reverse leakage current versus junction temperature. 12 5102030 1 2 5 10 vr(v) c(pf) f=1mhz tj=25c fig.7 : junction capacitance versus reverse voltage applied (typical values). 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1e-4 1e-3 1e-2 1e-1 5e-1 vfm(v) ifm(a) tj=100c tj=50c tj=25c fig.8 : forward voltage drop versus forward current (typical values). bat54, a, c, s 3/5
package mechanical data sot-23 b e s e e1 a d c l h a1 ref. dimensions millimeters inches min. max. min. max. a 0.89 1.4 0.035 0.055 a1 0 0.1 0 0.004 b 0.3 0.51 0.012 0.02 c 0.085 0.18 0.003 0.007 d 2.75 3.04 0.108 0.12 e 0.85 1.05 0.033 0.041 e1 1.7 2.1 0.067 0.083 e 1.2 1.6 0.047 0.063 h 2.1 2.75 0.083 0.108 l 0.6 typ. 0.024 typ. s 0.35 0.65 0.014 0.026 ordering type marking package weight base qty delivery mode bat54film d86 sot-23 0.01g 3000 tape & reel BAT54AFILM d84 sot-23 0.01g 3000 tape & reel bat54cfilm d87 sot-23 0.01g 3000 tape & reel bat54sfilm d88 sot-23 0.01g 3000 tape & reel epoxy meets ul94,v0 bat54, a, c, s 4/5
information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no responsibility for the co nsequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this publication are subject to change without notice. this publication supersedes and replaces all information previously supplied. stmicroelectronics products are not authorized for use as critical components in life support devices or systems without expres s written ap- proval of stmicroelectronics. the st logo is a registered trademark of stmicroelectronics ? 1999 stmicroelectronics - printed in italy - all rights reserved. stmicroelectronics group of companies australia - brazil - china - finland - france - germany - hong kong - india - italy - japan - malaysia malta - morocco - singapore - spain - sweden - switzerland - united kingdom - u.s.a. http://www.st.com 0.9 0.035 0.9 0.035 1.9 0.075 mm inch 2.35 0.92 1.1 0.043 1.1 0.043 1.45 0.037 0.9 0.035 footprint dimensions compatible sot-23 / sc-59 (in millimeters and inches) 0.9 0.035 0.9 0.035 2 0.079 mm inch 2.35 0.92 1 0.040 1 0.040 1 0.040 0.9 0.035 optimized sot-23 footprint dimensions (in millimeters and inches) bat54, a, c, s 5/5
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